• Preferred Choice for Semiconductor Devices LEDs and High-Temperature Electronics with Sapphire Wafers
Preferred Choice for Semiconductor Devices LEDs and High-Temperature Electronics with Sapphire Wafers

Preferred Choice for Semiconductor Devices LEDs and High-Temperature Electronics with Sapphire Wafers

Product Details:

Place of Origin: China
Brand Name: CQTGROUP
Certification: ISO:9001
Model Number: Sapphire (Al2O3)

Payment & Shipping Terms:

Minimum Order Quantity: 10 Pieces
Price: Negotiable
Packaging Details: Cassette, Jar, Film package
Delivery Time: 1-4 weeks
Payment Terms: T/T
Supply Ability: 10000 pieces/Month
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Detail Information

Material: Sapphire Wafer Type: Single Crystal
Color: White / Red / Blue Growth Method: Horizontally Directed Crystallization (HDC)
Surface: DSP SSP Purity: 99.999%
Flat Orientation: A-plane (1 1-2 0 ) ± 0.2°; C-plane (0 0-0 1 ) ± 0.2°, Projected C-Axis 45 +/- 2° Industry: Led,optical Glass,eli-ready Wafer

Product Description

Preferred Choice for Semiconductor Devices LEDs and High-Temperature Electronics with Sapphire Wafers

 
The Ultimate Solution for High-Performance Applications‌
Unlock unparalleled precision and durability with our premium ‌Sapphire Wafers‌, engineered to meet the demands of cutting-edge industries. Renowned for their exceptional hardness, optical clarity, and thermal stability, sapphire wafers are the gold standard for applications requiring extreme reliability in harsh environments.

Why Choose Our Sapphire Wafers?‌

  • ‌Superior Material Quality‌: Crafted from high-purity single-crystal sapphire, our wafers deliver unmatched chemical inertness, scratch resistance, and UV-IR transparency.
  • ‌Tailored Specifications‌: Available in diameters ranging from 2-inch to 8-inch, with customizable thicknesses (100μm to 2mm), orientations (C-plane, R-plane, A-plane), and surface finishes (polished, etched, or coated).
  • ‌Industry-Leading Performance‌: Ideal for LED production, RF devices, optical sensors, semiconductor substrates, and aerospace components.
  • ‌Rigorous Quality Control‌: Each wafer undergoes advanced inspection (X-ray, AFM, interferometry) to ensure sub-nanometer surface roughness and defect-free surfaces.

‌Applications That Shine‌
From next-gen 5G/6G communication systems to high-power laser optics and medical imaging devices, our sapphire wafers empower innovation. Their ability to withstand temperatures up to 2,000°C and resist plasma erosion makes them indispensable for semiconductor manufacturing and advanced R&D.

‌Partner with Confidence‌
Backed by 15+ years of expertise in crystal growth and wafer processing, we guarantee rapid prototyping, flexible order volumes, and global logistics support. Elevate your product’s performance while reducing lifecycle costs—sapphire’s longevity outperforms traditional materials like glass or silicon.

 

Preferred Choice for Semiconductor Devices LEDs and High-Temperature Electronics with Sapphire Wafers 0Preferred Choice for Semiconductor Devices LEDs and High-Temperature Electronics with Sapphire Wafers 1Preferred Choice for Semiconductor Devices LEDs and High-Temperature Electronics with Sapphire Wafers 2

 

OPTICAL PROPERTIES

Transmission

0.17 to 5.5 um

Refractive Index

1.75449 (o) 1.74663 (e) at 1.06 um

Reflection Loss

at 1.06 microns (2 surfaces) for o-ray - 11.7%; for e-ray - 14.2%

Absorption Index

0.3 x 10-3 cm-1 at 2.4 um

dN/dT

13.7 x 10-6 at 5.4 um

dn/dm = 0

1.5 um

 

Orientation

R-plane, C-plane, A-plane, M-plane or a specified orientation

Orientation Tolerance

± 0.3°

Diameter

2 inches, 3 inches, 4 inches, 6 inches, 8 inches or others

Diameter Tolerance

0.1mm for 2 inches, 0.2mm for 3 inches, 0.3mm for 4 inches, 0.5mm for 6 inches

Thickness

0.25mm, 0.33mm, 0.43mm, 0.65mm, 1mm or others;

Thickness Tolerance

25μm

Primary Flat Length

16.0±1.0mm for 2 inches, 22.0±1.0mm for 3 inches, 30.0±1.5mm for 4 inches, 47.5/50.0±2.0mm for 6 inches

Primary Flat Orientation

A-plane (1 1-2 0 ) ± 0.2°; C-plane (0 0-0 1 ) ± 0.2°, Projected C-Axis 45 +/- 2°

TTV

≤10µm for 2 inches, ≤15µm for 3 inches, ≤20µm for 4 inches, ≤25µm for 6 inches

BOW

≤10µm for 2 inches, ≤15µm for 3 inches, ≤20µm for 4 inches, ≤25µm for 6 inches

Front Surface

Epi-Polished (Ra< 0.3nm for C-plane, 0.5nm for other orientations)

Back Surface

Fine ground (Ra=0.6μm~1.4μm) or Epi-polished

Packaging

Packaged in a class 100 clean room environment

 

Preferred Choice for Semiconductor Devices LEDs and High-Temperature Electronics with Sapphire Wafers 3

 

Acceptance Check

Preferred Choice for Semiconductor Devices LEDs and High-Temperature Electronics with Sapphire Wafers 4

 

1. The product is fragile. We have adequately packed it and labeled it fragile. We deliver through excellent domestic and international express companies to ensure transportation quality.

 

2. After receiving the goods, please handle with care and check whether the outer carton is in good condition. Carefully open the outer carton and check whether the packing boxes are in alignment. Take a picture before you take them out.

 

3. Please open the vacuum package in a clean room when the products are to be applied.

 

4. If the products are found damaged during courier, please take a picture or record a video immediately. DO NOT take the damaged products out of the packaging box! Contact us immediately and we will solve the problem well.

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