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Revolutionizing Chip Fabrication Precision Innovation and Excellence
Product Details:
| Place of Origin: | China |
| Brand Name: | CQTGROUP |
| Certification: | ISO:9001, ISO:14001 |
| Model Number: | Chip Fabrication |
Payment & Shipping Terms:
| Minimum Order Quantity: | 1 pcs |
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| Price: | Negotiable |
| Packaging Details: | Cassette/ Jar package, vaccum sealed |
| Delivery Time: | 1-4 weeks |
| Payment Terms: | T/T |
| Supply Ability: | 10000 pcs/Month |
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Detail Information |
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| Product: | Chip Fabrication | Materials: | LiNbO₃,LiTaO₃,Crystal Quartz,Glass,Sapphire Etc. |
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| Type Of Service: | Lithography,Etching,Coating, Bonding | Lithography: | EBL Proximity Lithograph OStepper Lithography |
| Bonding: | Anodic Bonding，Eutectic Bonding，LPCVD/PECVD/ALD | Coating: | Electron Beam Evaporation/Magnetron Sputtering/LPCVD/PECVD/ALD |
Product Description
Revolutionizing Chip Fabrication Precision Innovation and Excellence
At the forefront of advanced chip foundry services, we empower innovation by transforming your design concepts into high-performance semiconductor and MEMS devices. With state-of-the-art facilities and a team of seasoned experts, we offer end-to-end solutions tailored to your unique requirements. Simply provide your design schematics and specifications, and we handle the rest—delivering precision-engineered wafers and components that meet the most demanding standards.
Our extensive portfolio of wafer materials includes Lithium Niobate (LiNbO₃), Lithium Tantalate (LiTaO₃), Single Crystal Quartz, Fused Silica Glass, Borosilicate Glass (BF33), Soda-Lime Glass, Silicon Wafers, and Sapphire, enabling us to support a wide range of applications across industries.
Cutting-Edge Processing Technologies
- Lithography:
- Electron Beam Lithography (EBL): Ideal for ultra-high-resolution patterning, enabling nanoscale features for advanced photonic and quantum devices.
- Proximity Lithography: Cost-effective solution for microfluidic chips and MEMS sensors.
- Stepper Lithography: High-throughput, high-precision patterning for large-area wafers, perfect for integrated circuits (ICs) and optical components.
- Etching:
- Ion Beam Etching (IBE): Delivers smooth, anisotropic etching for high-precision optical and acoustic wave devices.
- Deep Reactive Ion Etching (DRIE): Enables high-aspect-ratio structures for MEMS accelerometers, gyroscopes, and inertial sensors.
- Reactive Ion Etching (RIE): Versatile etching for thin-film transistors (TFTs) and microfluidic channels.
- Coating:
- Electron Beam Evaporation: Deposits high-purity thin films for optoelectronic devices and superconducting circuits.
- Magnetron Sputtering: Produces uniform coatings for RF filters, SAW devices, and protective layers.
- LPCVD/PECVD/ALD: Advanced deposition techniques for dielectric layers, passivation, and nanostructured coatings.
- Bonding:
- Anodic Bonding: Creates hermetic seals for MEMS pressure sensors and microfluidic devices.
- Eutectic Bonding: Ensures robust, low-resistance interconnects for power electronics and LED packaging.
- Adhesive/Wire Bonding: Provides flexible solutions for hybrid integration and IC packaging.
- Thinning, Cutting, and Drilling:
- Precision Grinding and Thinning: Achieves ultra-thin wafers for flexible electronics and advanced packaging.
- Dicing and Cutting: Enables clean, precise separation of dies for ICs and MEMS devices.
- Laser Drilling: Creates micro-vias and through-silicon vias (TSVs) for 3D integration and interconnects.
Success Stories: Transforming Ideas into Reality
Our proven expertise has enabled groundbreaking innovations across multiple industries:
- Surface Acoustic Wave (SAW) Devices: Fabricated high-performance SAW filters and sensors for 5G communications and IoT applications.
- Lithium Niobate Ring Transducers: Delivered ultra-sensitive transducers for quantum computing and photonic circuits.
- Microfluidic Chips: Enabled lab-on-a-chip solutions for biomedical diagnostics and drug discovery.
- MEMS Accelerometers and Gyroscopes: Produced high-precision inertial sensors for automotive and aerospace systems.
- Optical Waveguides: Fabricated low-loss waveguides for integrated photonics and LiDAR systems.
Why Choose Us?
- End-to-End Solutions: From design consultation to final packaging, we provide seamless support for your projects.
- Material Versatility: Access to a wide range of wafer materials for diverse applications.
- Advanced Technologies: Leveraging the latest fabrication techniques to deliver superior performance.
- Proven Expertise: A track record of successful projects across industries, from telecommunications to healthcare.
Partner with us to unlock the full potential of your designs. Whether you're developing next-generation MEMS devices, photonic circuits, or microfluidic systems, we are your trusted partner in innovation. Let’s redefine the future of technology together.
