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Chip Foundry Services Lithography Etching Coating Bonding Thinning
Product Details:
| Place of Origin: | China |
| Brand Name: | CQTGROUP |
| Certification: | ISO:9001, ISO:14001 |
| Model Number: | Chip Foundry Services |
Payment & Shipping Terms:
| Minimum Order Quantity: | 1 pc |
|---|---|
| Price: | Negotiable |
| Packaging Details: | Cassette/ Jar package, vaccum sealed |
| Delivery Time: | 1-4 weeks |
| Payment Terms: | T/T |
| Supply Ability: | 10000 pcs/Month |
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Detail Information |
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| Product: | Chip Foundry Services | Wafer Materials: | LiNbO₃,LiTaO₃,Crystal Quartz,Glass,Sapphire Etc. |
|---|---|---|---|
| Type Of Service: | Lithography,Etching,Coating, Bonding | Supporting Equipment: | Grinding/Thinning/Polishing/ Machines Etc. |
Product Description
Our Chip Foundry Services
Lithography Etching Coating Bonding Thinning
CQT GROUP specializes in providing comprehensive chip foundry services, catering to clients who require high-quality wafer processing based on their design specifications and requirements. Our advanced fabrication capabilities cover a wide range of processes, including lithography, etching, coating, thinning, bonding, cutting, and drilling, ensuring end-to-end solutions for your custom projects.
Wafer Materials
We work with a diverse selection of wafer materials to meet various application needs, including:
- Lithium Niobate (LiNbO₃)
- Lithium Tantalate (LiTaO₃)
- Single Crystal Quartz
- Fused Silica (Synthetic Quartz Glass)
- Borosilicate Glass (BF33)
- Soda-Lime Glass
- Silicon Wafers
- Sapphire
Key Fabrication Technologies
Our state-of-the-art facilities and expertise enable us to deliver precision and reliability across multiple fabrication stages:
1. Lithography
- Electron Beam Lithography (EBL)
- Proximity Lithography
- Stepper Lithography
2. Etching
- Ion Beam Etching (IBE)
- Deep Reactive Ion Etching (DRIE)
- Reactive Ion Etching (RIE)
3. Coating
- Electron Beam Evaporation
- Magnetron Sputtering
- Low-Pressure Chemical Vapor Deposition (LPCVD)
- Plasma-Enhanced Chemical Vapor Deposition (PECVD)
- Atomic Layer Deposition (ALD)
4. Bonding
- Anodic Bonding
- Eutectic Bonding
- Adhesive Bonding
- Wire Bonding
- Supporting Equipment
To ensure the highest quality and precision, our facility is equipped with advanced supporting machinery, including:
- Grinding Machines
- Thinning Machines
- Polishing Machines
- Dicing Machines
- Successful Projects
We have successfully delivered a variety of custom projects, including:
- Surface Acoustic Wave (SAW) Interdigital Transducers
- Lithium Niobate Ring Transducers
- Microfluidic Chips
- Custom MEMS Designs
Why Choose Us?
- End-to-End Solutions: From wafer selection to final product, we handle every step with precision.
- Advanced Technologies: Cutting-edge equipment and processes ensure superior quality.
- Customization: Tailored solutions to meet your specific design and performance requirements.
- Proven Expertise: A track record of successful projects across diverse applications.
Whether you are developing advanced MEMS devices, microfluidic systems, or specialized transducers, our foundry services are designed to bring your designs to life with unmatched precision and reliability. Partner with us to transform your innovative ideas into high-performance products.
