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Precision Fused Silica Wafer TTV 20µm PLTV≥95% Diameter 50.8mm for Optimal Performance
Product Details:
| Place of Origin: | China |
| Brand Name: | CSIMC |
| Certification: | ISO:9001, ISO:14001 |
| Model Number: | Fused Silica, Fused Quartz |
Payment & Shipping Terms:
| Minimum Order Quantity: | 5 pcs |
|---|---|
| Price: | Negotiable |
| Packaging Details: | Cassette/ Jar package, vaccum sealed |
| Delivery Time: | 1-4 weeks |
| Payment Terms: | T/T |
| Supply Ability: | 20000 pcs/Month |
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Detail Information |
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| Product Name: | JGS1 JGS2 JGS3 Glass And Quartz Wafer For Superior Optical Clarity Chemical Stability | Bow: | ±20µm, ±25µm, ±40µm, ±40µm, ±60µm, ±60µm |
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| PLTV(<0.5um): | ≥95%(5mm*5mm) | Edge Rounding: | Compliant With SEMI M1.2 Standard/refer To IEC62276 |
| Application: | Semiconductor, MEMS | Brand: | JGS1 JGS2 JGS3 |
| Surface: | DSP, SSP, DSL | TTV: | <8µm, <10µm, <15µm, <20µm, <30µm, <30µm |
| Highlight: | PLTV 95% Fused Silica Wafer,Precision Fused Silica Wafer,50.8mm Fused Silica Wafer |
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Product Description
Product Description:
The Fused Silica Wafer is available in different sizes, thicknesses, and surface finishes. The polished side Ra is less than 1.0nm or can be specified per request. The product is available in JGS1, JGS2, and JGS3 types of glass and quartz wafers for superior optical clarity and chemical stability. The product is also available in different surface finishes, including DSP, SSP, and DSL, depending on the application requirements.
The Fused Silica Wafer is known for its excellent properties, including high temperature resistance, low thermal expansion, and chemical inertness. It also has a low coefficient of thermal expansion, which makes it suitable for use in high-temperature applications. The product has a TTV of less than 8µm, <10µm, <15µm, <20µm, <30µm, or <30µm, depending on the specifications.
The Fused Silica Wafer is widely used in the semiconductor industry, where it is used as a substrate for the manufacture of integrated circuits. It is also used in optics, where it is used as a substrate for the deposition of thin films. The product is also used in electronics, where it is used as a substrate for the manufacture of sensors and other electronic devices.
The Fused Silica Wafer is an essential component in the manufacturing process of various electronic and optical devices. It is a high-quality product that is known for its excellent properties, including high temperature resistance, low thermal expansion, and chemical inertness. The product is available in different types, sizes, thicknesses, and surface finishes, making it suitable for different applications. Whether you need a Quartz Wafer, Silica Crystal Wafer, or SiO2 Wafer, the Fused Silica Wafer is the perfect solution for your needs.
Features:
- Product Name: Fused Silica Wafer
- Primary Flat: 22mm, 32.5mm, 42.5mm, 57.5mm/notch, notch, notch
- Thickness: 350um, 500um, 1000um
- Type: Fused Silica, Fused Quartz
- TTV: <8µm, <10µm, <15µm, <20µm, <30µm, <30µm
- Material: UV Fused Silica, Fused Quartz (JGS1, JGS2, JGS3)
Looking for a Silica Crystal Wafer or Vitreous Silica Wafer? Our Fused Silica Wafer is the perfect solution for your needs. With a variety of Primary Flat options, Thicknesses, Types, TTVs, and Materials available, we can help you find the right product for your project.
Technical Parameters:
| Product Category | Crystalline Silica Wafer |
|---|---|
| Brand | JGS1 JGS2 JGS3 |
| Edge Rounding | Compliant with SEMI M1.2 Standard/refer to IEC62276 |
| Thickness | 350um, 500um, 1000um |
| Surface | DSP, SSP, DSL |
| Primary Flat | 22mm, 32.5mm, 42.5mm, 57.5mm/notch, notch, notch |
| Polished side Ra | <1.0nm or specific per requested |
| LTV (5mmx5mm) | <2µm |
| PLTV(<0.5um) | ≥95%(5mm*5mm) |
| Bow | ±20µm, ±25µm, ±40µm, ±40µm, ±60µm, ±60µm |
Applications:
The Fused Silica Wafer is ideal for use in scenarios that require high transmission of ultraviolet and visible light. The wafer is available in various diameters including 50.8mm, 76.2mm, 100mm, 150mm, and 200mm, making it suitable for a wide range of applications. The wafer has a low thickness variation (LTV) of <2µm, ensuring precision in the application.
The Fused Silica Wafer can be used in different application scenarios including microelectronics, MEMS, and nanotechnology. In microelectronics, the product is used in the manufacturing of integrated circuits, LCD displays, and solar cells. In MEMS, the product is used in the production of sensors, actuators, and microfluidic devices. In nanotechnology, the product is used in the production of nanodevices, nanosensors, and nanofluidic devices.
The Fused Silica Wafer is also suitable for applications that require superior optical clarity and chemical stability. The wafer has a TTV of <8µm, <10µm, <15µm, <20µm, <30µm, and <30µm, making it ideal for use in precision optics, spectroscopy, and laser optics. The product is also used in the manufacturing of lenses, prisms, mirrors, and filters.
In conclusion, the BonTek Fused Silica Wafer is a versatile and reliable product that is suitable for use in various industries and applications. With its high transmission of ultraviolet and visible light, low thickness variation, superior optical clarity, and chemical stability, this product is the ideal choice for anyone looking for a high-quality wafer.
Support and Services:
Our Fused Silica Wafer product is designed to meet the highest quality standards and provide reliable performance in a variety of applications. Our technical support team is available to assist you with any questions or concerns you may have regarding the use and handling of our product.
We offer a range of services to ensure that our Fused Silica Wafers meet your specific requirements. Our services include custom wafer cutting, polishing, and cleaning. We also offer wafer inspection and testing services to ensure the quality and reliability of our product.
Our team of experienced technicians and engineers is dedicated to providing you with the support and services you need to achieve your goals. Contact us today to learn more about our Fused Silica Wafer product and how we can help you meet your technical requirements.
Packing and Shipping:
Product Packaging:
The Fused Silica Wafer will be carefully placed into a plastic container to prevent any damage during transportation. The container will be sealed and placed into a sturdy cardboard box with appropriate padding to prevent any movement during shipping.
Shipping:
The Fused Silica Wafer will be shipped via a trusted courier service to ensure timely and safe delivery. The shipping cost will be calculated based on the destination and weight of the package. A tracking number will be provided to the customer to track the package during transit.
FAQ:
A: Our fused silica wafer is from the brand BonTek.
Q: What are the model numbers available for your fused silica wafer?
A: We have two model numbers available, Fused Silica and Fused Quartz.
Q: What certifications does your fused silica wafer have?
A: Our fused silica wafer has ISO:9001 and ISO:14001 certifications.
Q: What is the minimum order quantity for your fused silica wafer?
A: The minimum order quantity for our fused silica wafer is 5 pieces.
Q: What is the packaging method for your fused silica wafer?
A: Our fused silica wafer comes in Cassette/Jar packaging and is vacuum sealed for safe delivery.
Q: What payment terms do you accept for your fused silica wafer?
A: We accept payment through T/T.
Q: What is the supply ability for your fused silica wafer?
A: Our fused silica wafer has a supply ability of 20,000 pieces per month.
Q: How long does it take for delivery of your fused silica wafer?
A: Delivery time for our fused silica wafer is between 1-4 weeks.
Q: Is the price for your fused silica wafer negotiable?
A: Yes, the price for our fused silica wafer is negotiable based on order quantity.
