• Roundness Edge Grinding Sapphire Wafer Single Side Polished Surface Quality
Roundness Edge Grinding Sapphire Wafer Single Side Polished Surface Quality

Roundness Edge Grinding Sapphire Wafer Single Side Polished Surface Quality

Product Details:

Place of Origin: China
Brand Name: BonTek
Certification: ISO:9001
Model Number: SAP

Payment & Shipping Terms:

Minimum Order Quantity: 10 pcs
Price: $40.00/ea
Packaging Details: Cassette, vacuum sealed
Delivery Time: 2~4 weeks
Payment Terms: TT/in advance
Supply Ability: 10000 pcs
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Detail Information

Crystal: Sapphire Diameter: 2inch-8inch
Bow & Warp: ≤20μm Roughness: Ra<0.3nm
Edge Grinding: Roundness Size: Customized
Material: Sapphire Clear Aperture: >90%
Highlight:

Roundness Edge Grinding Sapphire Wafer

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Single Side Polished Sapphire Wafer

Product Description

Roundness Edge Grinding Sapphire Wafer Single Side Polished Surface Quality


Product Description:

Sapphire Wafer is a high-performance sapphire plate manufactured with a high-grade sapphire substrate. It has an orientation of ±0.5°, a wafer shape, a clear aperture of greater than 90%, and TTV of ≤3μm. It is also customizable in size to meet the needs of customers. This high-quality sapphire plate is perfect for use in a variety of applications, such as electronics, optics, and aerospace. It can withstand high temperatures, is scratch-resistant, and is extremely durable. With its unique properties, Sapphire Wafer is an ideal choice for any application requiring a reliable and cost-effective sapphire plate.

 

Technical Parameters:

Sapphire Wafer
Item 2 Inch 4 Inch 6 Inch
Crystal LED Grade Sapphire LED Grade Sapphire LED Grade Sapphire
Purity >99.998% >99.998% >99.998%
Color Transparent Transparent Transparent
Orientation C plane tiled M axis 0.20°±0.1° C plane tiled M axis 0.20°±0.1° C plane tiled M axis 0.20°±0.1°
Diameter 50.8±0.1mm 100±0.2mm 150±0.2mm
Thickness 430±15um 650±25um 1300±25um
PF Location A-axist±0.2° A-axist±0.2° A-axist±0.2°
Flat Length 16.0±1.0mm 30.0±1.0mm 49.0±1.0mm
Front Side Surface Mirror polished EPI-Ready Mirror polished EPI-Ready Mirror polished EPI-Ready
Surface Roughness Ra<3A Ra<3A Ra<3A
Back Side Roughness Fine ground, Ra=1.0±0.2um Fine ground, Ra=1.0±0.2um Fine ground, Ra=1.0±0.2um
TTV <5.0um <10um <15um
BOW 0~-5um 0~-10um 0~-30um
Warp <10um <15um <40um
Bubble& Color None by visual inspection in fluorescent light
Cleanliness Free visible contamination
Packaging Vacuum packed in one-piece box or Entegris cassettes of 25

 

Roundness Edge Grinding Sapphire Wafer Single Side Polished Surface Quality 0Roundness Edge Grinding Sapphire Wafer Single Side Polished Surface Quality 1

Applications:

BonTek's SAP series sapphire wafers are world-renowned for their high-end quality and reliable performance, making them ideal for a wide variety of applications. With a model number of SAP, the sapphire wafer is certified with ISO:9001, and has a minimum order quantity of 10 pcs, with a price of $60.00/ea. The wafer comes in a cassette, vacuum sealed for optimal performance, with a delivery time of 2~4 weeks. Payment terms are TT/in advance, and supply ability is 10000 pcs. The parallelism of the wafer is ≤3 Arc Sec, with bow & warp of ≤20μm. The thickness of the sapphire plate varies from 0.5mm-3mm, with excellent edge grinding and roundness, with an orientation of ±0.5°. BonTek's SAP series of sapphire wafers are perfect for use in aerospace, electronic, optical, and medical industries, providing users with an unparalleled level of performance.

 

Customization:

Customized Sapphire Wafer by BonTek

Brand Name: BonTek
Model Number: SAP
Place of Origin: China
Certification: ISO:9001
Minimum Order Quantity: 10 pcs
Price: $60.00/ea
Packaging Details: Cassette, vacuum sealed
Delivery Time: 2~4 weeks
Payment Terms: TT/in advance
Supply Ability: 10000 pcs
Material: Sapphire
TTV: ≤3μm
Orientation: ±0.5°
Surface Roughness: Ra<0.2nm
Thickness: 0.5mm-3mm

BonTek provides customized Sapphire Wafer with ISO:9001 Certification. Our Sapphire Slice is made from superior quality material with TTV≤3μm, Orientation ±0.5°, and Surface Roughness Ra<0.2nm. The thickness of Sapphire Slice ranges from 0.5mm to 3mm. Our minimum order quantity is 10 pcs and the price is $60.00/ea. We also offer vacuum sealed cassette packaging and delivery time is 2~4 weeks. Payment terms is TT/in advance and we can supply 10000 pcs at maximum.

 

Packing and Shipping:

Sapphire Wafer Packaging and Shipping:
Sapphire wafers are packaged and shipped in a secure container with anti-static foam. The package is sealed to prevent contamination and ensure the wafers are not damaged during transit. We use a courier service to ensure the product reaches its destination quickly and safely. All shipments are tracked to ensure delivery.

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