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2inch - 8inch Sapphire Wafer With Perpendicularity ≤3 Arc Min For Industrial Applications
Product Details:
| Place of Origin: | China |
| Brand Name: | BonTek |
| Certification: | ISO:9001 |
| Model Number: | SAP |
Payment & Shipping Terms:
| Minimum Order Quantity: | 10 pcs |
|---|---|
| Price: | $60.00/ea |
| Packaging Details: | Cassette, vacuum sealed |
| Delivery Time: | 2~4 weeks |
| Payment Terms: | TT/in advance |
| Supply Ability: | 10000 pcs |
|
Detail Information |
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| Diameter: | 2inch-8inch | Thickness: | 0.5mm-3mm |
|---|---|---|---|
| Orientation: | ±0.5° | Shape: | Wafer |
| Parallelism: | ≤3 Arc Sec | TTV: | <10um |
| Edge Grinding: | Roundness | Surface Roughness: | Ra<0.2nm |
| Highlight: | 2inch Sapphire Wafer,Industrial Sapphire Wafer,Round Sapphire Slice |
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Product Description
High-Performance Sapphire Wafer with Perpendicularity ≤3 Arc Min for Industrial Applications
Product Description:
Sapphire Slice, Sapphire Wafer, Sapphire Substrate, and Sapphire Plate are produced with surface quality of single side polished, total thickness variation of less than 3μm, wafer shape, and clear aperture of more than 90%. The material used for production is Sapphire. The Sapphire Slice, Wafer, Substrate, and Plate are widely used in the industry for their unique structural and chemical properties. Sapphire Slice, Wafer, Substrate, and Plate are highly resistant to corrosion and abrasion; they have a high melting point and are able to withstand extreme temperatures; they are also highly durable and can withstand high pressures and impacts.
The Sapphire Slice, Wafer, Substrate, and Plate are available in a variety of sizes and thicknesses, and can be cut into custom shapes and sizes to meet the demands of various applications. These slices, wafers, substrates, and plates are ideal for use in LED lighting, automotive components, aerospace, semiconductor packaging, and many other applications.
Features:
- Product Name: Sapphire Wafer
- Perpendicularity: ≤3 Arc Min
- Surface Quality: Single Side Polished
- Edge Grinding: Roundness
- Flatness: λ/10
- Orientation: ±0.5°
Technical Parameters:
| Parameter | Value |
|---|---|
|
Perpendicularity |
≤3 Arc Min |
|
Clear Aperture |
>90% |
|
Edge Grinding |
Roundness |
|
TTV |
≤3μm |
|
Parallelism |
≤3 Arc Sec |
|
Orientation |
±0.5° |
|
Thickness |
0.5mm-3mm |
|
Size |
Customized |
|
Diameter |
2inch-8inch |
|
Surface Roughness |
Ra<0.2nm |
Applications:
BonTek Sapphire Wafer, model number SAP, is a certified product with ISO 9001. With a minimum order quantity of 10 pcs and a price of $60.00/ea, the wafer is packaged in a cassette with vacuum sealed. The delivery time is 2~4 weeks, and the payment terms are TT/in advance. The supply ability is 10000 pcs. The clear aperture of Sapphire Wafer is >90%, and the surface roughness is Ra<0.2nm. The edge grinding is roundness, and the thickness ranges from 0.5mm to 3mm. The perpendicularity is ≤3 Arc Min.
BonTek Sapphire Wafer is the perfect choice for customers looking for a high quality Sapphire Slice or Sapphire Wafer Substrate. With its ISO 9001 certification, the product is sure to deliver superior performance and reliability. The minimum order quantity, price, delivery time, and payment terms are all attractive features that make BonTek Sapphire Wafer the ideal product for your needs.
Packing and Shipping:
Sapphire Wafers are packaged in foam-lined cardboard boxes and shipped in protective packaging to ensure safe arrival. Each box is labeled with the product name and contents, and is securely sealed. All orders are shipped via a reliable courier service.