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F-HUV Quartz Borosilicate Glass Wafer 10mm For MEMS And Semiconductor
Product Details:
| Place of Origin: | China |
| Brand Name: | BonTek |
| Certification: | ISO:9001 |
| Model Number: | Glass substrates |
Payment & Shipping Terms:
| Minimum Order Quantity: | 5 pcs |
|---|---|
| Packaging Details: | Cassette, Jar |
| Delivery Time: | 2 weeks |
| Payment Terms: | TT/in advance |
| Supply Ability: | 100000/month |
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Detail Information |
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| Thickness: | 0.1-10mm | Brand: | Corning, Schott, OHARA, FLH, China Glass |
|---|---|---|---|
| Primary Flat: | 16±2mm, 22±2mm, 32±2mm, 47.5±2mm, 57.5±2mm, Notch | OHARA Model: | SK1300, SK1310 |
| COC: | Per Request | Density: | 2.20g/cm3 |
| Inspection Report: | Per Request | Corning Model: | C7980, C7979, Eagle XG, Gorilla |
| Highlight: | F-HUV Quartz Borosilicate Glass Wafer,Borosilicate Glass Wafer for MEMS,Fused Silica Wafer 10mm |
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Product Description
Product Description:
Fused Silica Wafer is a type of IC Silicon Wafer, also known as Aluminum Silicate Glass. It is produced by melting pure quartz sand and other minerals at high temperatures. Fused Silica Wafer has very low thermal expansion coefficient, excellent electrical insulation properties, and superior thermal shock resistance. It is widely used in semiconductor and optoelectronic industries.
Fused Silica Wafer is available from well-known brands such as Corning, Schott, OHARA, and FLH. The warp of the wafer is below 35um, and the OH content is below 5ppm, 10ppm, or 100ppm. The thickness of the wafer ranges from 0.1 to 10mm, and the surface roughness is under 1.0nm.
Fused Silica Wafer also has great chemical and mechanical stability, as well as high thermal conductivity. Its ability to withstand extreme temperature makes it suitable for various applications, such as optical components, lenses, and microscopes.
Features:
- Product Name: Fused Silica Wafer
- Material: Alumina Silicate Glass, High Purity Fused Silica, Aluminum Silicate Glass
- Coating: AR Coating, HR Coating, V-Coat
- Bevel: 0.25mm X 45°
- Diameter: 2-12 Inch
- Certificate: ISO9001, RoHS
- Brand: Corning, Schott, OHARA, FLH, China Glass
Technical Parameters:
| Material | UV Fused Silica, Fused Quartz (JGS1, JGS2, JGS3) | ||||||
| Specification | unit | 3” | 4” | 5" | 6" | 8" | 12" |
| Diameter (or Square) | mm | 76.2 | 100 | 125 | 150 | 200 | 300 |
| Tol(±) | mm | <0.1~0.25 mm | |||||
| Thinnest Thickness | mm | >0.10 | >0.10 | >0.30 | >0.30 | >0.30 | >0.50 |
| Primary Flat | mm | 22 | 32.5 | 42.5 | 57.5/notch | notch | notch |
| LTV (5mmx5mm) | µm | <2 | <2 | <2 | <2 | <2 | <10 |
| TTV | µm | <8 | <10 | <15 | <20 | <30 | <30 |
| Bow | µm | ±20 | ±25 | ±40 | ±40 | ±60 | ±60 |
| Warp | µm | <30 | <40 | <50 | <50 | <60 | <60 |
| PLTV(<0.5um) | % | ≥95%(5mm*5mm) | |||||
| Transmittance | UV, Optical, IR or Custom option | ||||||
| Edge Rounding | mm | Compliant with SEMI M1.2 Standard/refer to IEC62276 | |||||
| Surface Type | Single Side Polished /Double Sides Polished | ||||||
| Polished side Ra | nm | <1.0nm or specific per requested | |||||
| Back Side Criteria | µm | General is 0.2-0.5µm or as customized | |||||
| Appearance | Contamination | None | |||||
| Particles>0.3µm | <=30 | ||||||
| Saw Marks, striations | None | ||||||
| Scratch | None | ||||||
| Cracks, saw marks, stains | None | ||||||
| Parameter | Value |
|---|---|
| Material | Fused Silica Glass |
| BOW | <30um |
| Transmission | IR, Visible, DUV |
| Transmission Range | 0.17~2.1um, 0.26~2.1um, .0185~3.5um |
| Metal Impurities | <0.2ppm |
| Coating | AR, HR, V-Coat |
| TTV | <2um, <5um |
| Diameter | 2-12 Inch |
| Application | Semiconductor, MEMS, Medical |
| Certificate | ISO9001, RoHS |
Applications:
BonTek Fused Silica Wafers are crafted from high purity alumina silicate glass, and come with an ISO:9001 certification. The model number for these glass substrates is C7980, C7979, Eagle XG, and Gorilla. Offering excellent parallelism of 3 Arc Sec, the transmission range of these wafers is 0.17~2.1um, 0.26~2.1um, and 0.185~3.5um. The minimum order quantity for these wafers is 5 pcs, and they are available in cassette and jar packaging. BonTek also offers a range of coatings, including AR, HR, and V Coat. With a quick delivery time of 2 weeks and a supply ability of 100000/month, BonTek Fused Silica Wafers are an ideal choice for customers looking for high-quality, high purity products. The Total Thickness Variation (TTV) of these wafers is <2um, <5um, making them perfect for use in a variety of applications. Payment can be made through TT or in advance. For customers looking for reliable, high-grade Fused Silica Wafers, BonTek is the perfect choice.
Customization:
BonTek provides a wide range of custom-made services for Fused Silica Wafer, including IC Silicon Wafer, Aluminum Silicate Glass and Fused Silica Wafer.
Product Details:
- Brand Name: BonTek
- Model Number: Glass substrates
- Place of Origin: China
- Certification: ISO:9001
- Minimum Order Quantity: 5 pcs
- Packaging Details: Cassette, Jar
- Delivery Time: 2 weeks
- Payment Terms: TT/in advance
- Supply Ability: 100000/month
- Inspection Report: Per Request
- Schott Model: Borofloat 33, B270, D263, Zerodur, MEMpax, BK7
- Transmission Range: 0.17~2.1um, 0.26~2.1um, .0185~3.5um
- Surface Roughness: Ra<1.0nm
- OH Content: <5ppm, <10ppm, <100ppm
Support and Services:
We provide technical support and services for our Fused Silica Wafer, including:
- Pre-sales technical advisory
- In-sales product consulting
- After-sales technical support
- Product maintenance
- User manual and documentation
Our technical team is available 24/7 to provide assistance and advice to customers. We also offer spare parts and accessories for Fused Silica Wafer, and can provide training and upgrade services if needed.