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76.2 mm /- 0.1 mm Diameter C-plane Sapphire Wafer with A-plane 11-20 Primary Flat
Product Details:
| Place of Origin: | China |
| Brand Name: | CSIMC |
| Certification: | ISO:9001 |
| Model Number: | Sapphire (Al2O3) |
Payment & Shipping Terms:
| Minimum Order Quantity: | 5 Pieces |
|---|---|
| Price: | Negotiable |
| Packaging Details: | Cassette, Jar, Film package |
| Delivery Time: | 1-4 weeks |
| Payment Terms: | T/T |
| Supply Ability: | 10000 pieces/Month |
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Detail Information |
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| Material: | Sapphire Wafer | Purity: | 99.999％ |
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| Melting Point: | 2040 °C | Diameter: | 76.2 Mm /- 0.1 Mm |
| Thermal Expansion: | 5.6 X 10 -6 /K (parallel C-axis) & 5.0 (perpendicular C-axis) X 10 -6 /K | Hardness: | Knoop 2000 Kg/mm 2 With 2000g Indenter |
| Specific Heat Capacity: | 419 J/(kg X K) | Dielectric Constant: | 11.5 (parallel C-axis) 9.4 (perpendicular C-axis) At 1MHz |
| Highlight: | Semiconductor Sapphire Wafer,Semiconductor Wafer Infrared,C-plane Sapphire Wafer |
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Product Description
76.2 mm /- 0.1 mm Diameter C-plane Sapphire Wafer with A-plane 11-20 Primary Flat
Our sapphire wafers are precision-crafted using the finest materials and cutting-edge technology. Sapphire, a hard and optically superior material, offers exceptional durability, thermal stability, and optical transparency, making it ideal for a wide range of applications.
Our wafers are perfect for the semiconductor industry, where they are used in LED chip substrates, optoelectronic devices, and high-power electronics. Their high thermal conductivity ensures efficient heat dissipation, while their chemical inertness and resistance to scratching make them long-lasting and reliable.
Moreover, our sapphire wafers are available in various sizes and thicknesses to meet the specific needs of our customers. We pride ourselves on our commitment to quality and innovation, ensuring that our products meet the highest standards of performance and reliability.
Invest in our sapphire wafers today and enjoy the benefits of superior quality, durability, and performance. Contact us now to learn more about our products and how they can enhance your business.
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Item |
3-inch C-plane(0001) 500μm Sapphire Wafers |
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Crystal Materials |
99,999%, High Purity, Monocrystalline Al2O3 |
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Grade |
Prime, Epi-Ready |
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Surface Orientation |
C-plane(0001) |
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C-plane off-angle toward M-axis 0.2 +/- 0.1° |
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Diameter |
76.2 mm +/- 0.1 mm |
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Thickness |
500 μm +/- 25 μm |
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Primary Flat Orientation |
A-plane(11-20) +/- 0.2° |
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Primary Flat Length |
22.0 mm +/- 1.0 mm |
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Single Side Polished |
Front Surface |
Epi-polished, Ra < 0.2 nm (by AFM) |
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(SSP) |
Back Surface |
Fine ground, Ra = 0.8 μm to 1.2 μm |
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Double Side Polished |
Front Surface |
Epi-polished, Ra < 0.2 nm (by AFM) |
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(DSP) |
Back Surface |
Epi-polished, Ra < 0.2 nm (by AFM) |
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TTV |
< 15 μm |
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BOW |
< 15 μm |
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WARP |
< 15 μm |
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Cleaning / Packaging |
Class 100 cleanroom cleaning and vacuum packaging, |
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25 pieces in one cassette packaging or single piece packaging. |
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Item |
4-inch C-plane(0001) 650μm Sapphire Wafers |
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Crystal Materials |
99,999%, High Purity, Monocrystalline Al2O3 |
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|
Grade |
Prime, Epi-Ready |
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Surface Orientation |
C-plane(0001) |
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C-plane off-angle toward M-axis 0.2 +/- 0.1° |
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Diameter |
100.0 mm +/- 0.1 mm |
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Thickness |
650 μm +/- 25 μm |
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Primary Flat Orientation |
A-plane(11-20) +/- 0.2° |
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Primary Flat Length |
30.0 mm +/- 1.0 mm |
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Single Side Polished |
Front Surface |
Epi-polished, Ra < 0.2 nm (by AFM) |
|
(SSP) |
Back Surface |
Fine ground, Ra = 0.8 μm to 1.2 μm |
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Double Side Polished |
Front Surface |
Epi-polished, Ra < 0.2 nm (by AFM) |
|
(DSP) |
Back Surface |
Epi-polished, Ra < 0.2 nm (by AFM) |
|
TTV |
< 20 μm |
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|
BOW |
< 20 μm |
|
|
WARP |
< 20 μm |
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|
Cleaning / Packaging |
Class 100 cleanroom cleaning and vacuum packaging, |
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|
25 pieces in one cassette packaging or single piece packaging. |
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Item |
6-inch C-plane(0001) 1300μm Sapphire Wafers |
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Crystal Materials |
99,999%, High Purity, Monocrystalline Al2O3 |
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|
Grade |
Prime, Epi-Ready |
|
|
Surface Orientation |
C-plane(0001) |
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|
C-plane off-angle toward M-axis 0.2 +/- 0.1° |
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Diameter |
150.0 mm +/- 0.2 mm |
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Thickness |
1300 μm +/- 25 μm |
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Primary Flat Orientation |
A-plane(11-20) +/- 0.2° |
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Primary Flat Length |
47.0 mm +/- 1.0 mm |
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Single Side Polished |
Front Surface |
Epi-polished, Ra < 0.2 nm (by AFM) |
|
(SSP) |
Back Surface |
Fine ground, Ra = 0.8 μm to 1.2 μm |
|
Double Side Polished |
Front Surface |
Epi-polished, Ra < 0.2 nm (by AFM) |
|
(DSP) |
Back Surface |
Epi-polished, Ra < 0.2 nm (by AFM) |
|
TTV |
< 25 μm |
|
|
BOW |
< 25 μm |
|
|
WARP |
< 25 μm |
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|
Cleaning / Packaging |
Class 100 cleanroom cleaning and vacuum packaging, |
|
|
25 pieces in one cassette packaging or single piece packaging. |
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Acceptance Check
1. The product is fragile. We have adequately packed it and labeled it fragile. We deliver through excellent domestic and international express companies to ensure transportation quality.
2. After receiving the goods, please handle with care and check whether the outer carton is in good condition. Carefully open the outer carton and check whether the packing boxes are in alignment. Take a picture before you take them out.
3. Please open the vacuum package in a clean room when the products are to be applied.
4. If the products are found damaged during courier, please take a picture or record a video immediately. DO NOT take the damaged products out of the packaging box! Contact us immediately and we will solve the problem well.